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publication number 21504 revision e amendment 5 issue date november 2, 2006 am29f800b data sheet the following document contains inform ation on spansion memory products. continuity of specifications there is no change to this data sheet as a result of offering the device as a spansion product. any changes that have been made are the result of no rmal data sheet improvement and are noted in the document revision summary. for more information please contact your local sales office for additi onal information about spansion memory solutions.
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data sheet this data sheet states amd?s current technical specificat ions regarding the product described herein. this data sheet may be revised by subsequent versions or modifications due to changes in technical specifications. publication# 21504 rev: e amendment: 5 issue date: november 2, 2006 am29f800b 8 megabit (1 m x 8- bit/512 k x 16-bit) cmos 5.0 volt-only, bo ot sector flash memory distinctive characteristics single power supply operation ? 5.0 volt-only operation for read, erase, and program operations ? minimizes system level requirements manufactured on 0.32 m process technology ? compatible with 0.5 m am29f800 device high performance ? access times as fast as 55 ns low power consumption (typical values at 5 mhz) ? 1 a standby mode current ? 20 ma read current (byte mode) ? 28 ma read current (word mode) ? 30 ma program/erase current flexible sector architecture ? one 16 kbyte, two 8 kbyte, one 32 kbyte, and fifteen 64 kbyte sectors (byte mode) ? one 8 kword, two 4 kword, one 16 kword, and fifteen 32 kword sectors (word mode) ? supports full chip erase ? sector protection features: a hardware method of locking a sector to prevent any program or erase operations within that sector ? sectors can be locked via programming equipment temporary sector unprotect feature allows code changes in previously locked sectors top or bottom boot block configurations available embedded algorithms ? embedded erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors ? embedded program algorithm automatically writes and verifies data at specified addresses minimum 1,000,000 program/erase cycles per sector guaranteed 20-year data retention at 125 c ? reliable operation for the life of the system package option ? 48-pin tsop ? 44-pin so ? 48-ball fbga ? known good die (kgd) (see publication number 21631) compatibility with jedec standards ? pinout and software compatible with single- power-supply flash ? superior inadvertent write protection data# polling and toggle bits ? provides a software method of detecting program or erase operation completion ready/busy# pin (ry/by#) ? provides a hardware method of detecting program or erase cycle completion erase suspend/erase resume ? suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation hardware reset pin (reset#) ? hardware method to reset the device to reading array data
2 am29f800b 21504e5 november 2, 2006 data sheet general description the am29f800b is an 8 mbit, 5.0 volt-only flash memory organized as 1,048,576 bytes or 524,288 words. the device is offered in 44-pin so, 48-pin tsop, and 48-ball fbga packages. the device is also available in known good die (kgd) form. for more information, refer to publication number 21631. the word-wide data (x16) appears on dq15?dq0; the byte-wide (x8) data appears on dq7?dq0. this device is designed to be programmed in-system with the stan - dard system 5.0 volt v cc supply. a 12.0 v v pp is not required for write or erase operations. the device can also be programmed in standard eprom program - mers. this device is manufactured using amd?s 0.32 m process technology, and offers all the features and ben - efits of the am29f800, which was manufactured using 0.5 m process technology. the standard device offers access times of 55, 70, 90, and 120 ns, allowing high speed microprocessors to operate without wait states. to eliminate bus contention the device has separate chip enable (ce#), write enable (we#) and output enable (oe#) controls. the device requires only a single 5.0 volt power sup - ply for both read and write functions. internally gener - ated and regulated voltages are provided for the program and erase operations. the device is entirely command set compatible with the jedec single-power-supply flash standard . com - mands are written to the command register using stan - dard microprocessor write timings. register contents serve as input to an internal state-machine that con - trols the erase and programming circuitry. write cycles also internally latch addresses and data needed for the programming and erase operations. reading data out of the device is similar to reading from other flash or eprom devices. device programming occurs by executing the program command sequence. this initiates the embedded program algorithm?an internal algorithm that auto - matically times the program pulse widths and verifies proper cell margin. device erasure occurs by executing the erase com - mand sequence. this initiates the embedded erase algorithm?an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. during erase, the device automatically times the erase pulse widths and verifies proper cell margin. the host system can detect whether a program or erase operation is complete by observing the ry/by# pin, or by reading the dq7 (data# polling) and dq6 (toggle) status bits . after a program or erase cycle has been completed, the device is ready to read array data or accept another command. the sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. the device is fully erased when shipped from the factory. hardware data protection measures include a low v cc detector that automatically inhibits write opera - tions during power transitions. the hardware sector protection feature disables both program and erase operations in any combination of the sectors of mem - ory. this can be achieved via programming equipment. the erase suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. true background erase can thus be achieved. the hardware reset# pin terminates any operation in progress and resets the internal state machine to reading array data. the reset# pin may be tied to the system reset circuitry. a sys tem reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the flash memory. the system can place the device into the standby mode . power consumption is greatly reduced in this mode. amd?s flash technology combines years of flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effective - ness. the device electrically erases all bits within a sector simultaneously via fowler-nordheim tunneling. the data is programmed using hot electron injection.
november 2, 2006 21504e5 am29f800b 3 data sheet table of contents product selector guide . . . . . . . . . . . . . . . . . . . . . 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 connection diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 special handling instructions for fbga package .................... 6 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7 logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ordering information . . . . . . . . . . . . . . . . . . . . . . . 8 device bus operations . . . . . . . . . . . . . . . . . . . . . . 9 table 1. am29f800b device bus operations ..................................9 word/byte configuration .......................................................... 9 requirements for reading array data ..................................... 9 writing commands/command sequences .............................. 9 program and erase operation status .................................... 10 standby mode ........................................................................ 10 reset#: hardware reset pin ............................................... 10 output disable mode .............................................................. 10 table 2. am29f800bt top boot block sector address table .......11 table 3. am29f800bb bottom boot block sector address table ..12 autoselect mode ..................................................................... 12 table 4. am29f800b autoselect codes (high voltage method) ....13 sector protection/unprotection ............................................... 13 temporary sector unprotect .................................................. 13 figure 1. temporary sector unprotect operation........................... 13 hardware data protection ...................................................... 14 command definitions . . . . . . . . . . . . . . . . . . . . . . 14 reading array data ................................................................ 14 reset command ..................................................................... 14 autoselect command sequence ............................................ 15 word/byte program command sequence ............................. 15 figure 2. program operation .......................................................... 15 chip erase command sequence ........................................... 15 sector erase command sequence ........................................ 16 erase suspend/erase resume commands ........................... 16 figure 3. erase operation............................................................... 17 command definitions ............................................................. 18 table 5. am29f800b command definitions ...................................18 write operation status . . . . . . . . . . . . . . . . . . . . . 19 dq7: data# polling ................................................................. 19 figure 4. data# polling algorithm ................................................... 19 ry/by#: ready/busy# ........................................................... 20 dq6: toggle bit i .................................................................... 20 dq2: toggle bit ii ................................................................... 20 reading toggle bits dq6/dq2 .............................................. 20 dq5: exceeded timing limits ................................................ 21 dq3: sector erase timer ....................................................... 21 figure 5. toggle bit algorithm......................................................... 21 table 6. write operation status ......................................................22 absolute maximum ratings . . . . . . . . . . . . . . . . . 23 figure 6. maximum negative overshoot waveform ....................... 23 figure 7. maximum positive overshoot waveform......................... 23 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . 23 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24 ttl/nmos compatible .......................................................... 24 cmos compatible .................................................................. 25 test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 8. test setup....................................................................... 26 table 7. test specifications ........................................................... 26 key to switching waveforms. . . . . . . . . . . . . . . . 26 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27 read operations .................................................................... 27 figure 9. read operations timings ............................................... 27 hardware reset (reset#) .................................................... 28 figure 10. reset# timings .......................................................... 28 word/byte configuration (byte#) ........................................ 29 figure 11. byte# timings for read operations............................ 29 figure 12. byte# timings for write operations............................ 29 erase/program operations ..................................................... 30 figure 13. program operation timings.......................................... 31 figure 14. chip/sector erase operation timings .......................... 32 figure 15. data# polling timings (during embedded algorithms). 33 figure 16. toggle bit timings (during embedded algorithms)...... 33 figure 17. dq2 vs. dq6................................................................. 34 temporary sector unprotect .................................................. 34 figure 18. temporary sector unprotect timing diagram .............. 34 figure 19. alternate ce# controlled write operation timings ...... 36 erase and programming performance . . . . . . . 37 latchup characteristics . . . . . . . . . . . . . . . . . . . . 37 tsop and so pin capacitance . . . . . . . . . . . . . . 37 data retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 physical dimensions . . . . . . . . . . . . . . . . . . . . . . 38 so 044?44-pin small outline package ................................ 38 ts 048?48-pin standard pinout thin small outline package (tsop) ........................................................ 39 fbb048?48-ball fine-pitch ball grid array (fbga) 6 x 9 mm package .................................................................................. 40 revision summary . . . . . . . . . . . . . . . . . . . . . . . . 41 revision a (august 1997) ....................................................... 41 revision b (october 1997) ..................................................... 41 revision c (january 1998) ..................................................... 41 revision c+1 (april 1998) ....................................................... 41 revision c+2 (april 1998) ....................................................... 41 revision d (january 1999) ..................................................... 42 revision d+1 (march 23, 1999) .............................................. 42 revision d+2 (july 2, 1999) ................................................... 42 revision e (november 16, 1999) ............................................ 42 revision e+1 (august 4, 2000) ............................................... 42 revision e+2 (june 4, 2004) .................................................. 42 revision e3 (december 22, 2005) .......................................... 42 revision e4 (may 19, 2006) ................................................... 42 revision e5 (november 2, 2006) ............................................ 42
4 am29f800b 21504e5 november 2, 2006 data sheet product selector guide note: see ?ac characteristics? for full specifications. block diagram family part number am29f800b speed option v cc = 5.0 v 10% -55 -70 -90 -120 max access time, ns (t acc ) 55 70 90 120 max ce# access time, ns (t ce ) 55 70 90 120 max oe# access time, ns (t oe ) 30 30 35 50 input/output buffers x-decoder y-decoder chip enable output enable logic erase voltage generator pgm voltage generator timer v cc detector state control command register v cc v ss we# byte# ce# oe# stb stb dq0 ? dq15 (a-1) sector switches ry/by# reset# data latch y-gating cell matrix address latch a0?a18
november 2, 2006 21504e5 am29f800b 5 data sheet connection diagrams this device is also available in known good die (kgd) form. refer to publication number 21631 for more information. a1 a15 a18 a14 a13 a12 a11 a10 a9 a8 nc nc we# reset# nc nc ry/by# a17 a7 a6 a5 a4 a3 a2 1 16 2 3 4 5 6 7 8 17 18 19 20 21 22 23 24 9 10 11 12 13 14 15 a16 dq2 byte# v ss dq15/a-1 dq7 dq14 dq6 dq13 dq9 dq1 dq8 dq0 oe# v ss ce# a0 dq5 dq12 dq4 v cc dq11 dq3 dq10 48 33 47 46 45 44 43 42 41 40 39 38 37 36 35 34 25 32 31 30 29 28 27 26 48-pin tsop?standard pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 ry/by# a18 a17 a7 a6 a5 a4 a3 a2 a1 a0 ce# v ss oe# dq0 dq8 dq1 dq9 dq2 dq10 dq3 dq11 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 reset# we# a8 a9 a10 a11 a12 a13 a14 a15 a16 byte# v ss dq15/a-1 dq7 dq14 dq6 dq13 dq5 dq12 dq4 v cc so
6 am29f800b 21504e5 november 2, 2006 data sheet connection diagrams this device is also available in known good die (kgd) form. refer to publication number 21631 for more information. special handling instructions for fbga package special handling is required for flash memory products in fbga packages. flash memory devices in fbga packages may be damaged if exposed to ultrasonic cleaning methods. the package and/or data integrity may be compromised if the package body is exposed to temperatures above 150 c for prolonged periods of time. a1 b1 c1 d1 e1 f1 g1 h1 a2 b2 c2 d2 e2 f2 g2 h2 a3 b3 c3 d3 e3 f3 g3 h3 a4 b4 c4 d4 e4 f4 g4 h4 a5 b5 c5 d5 e5 f5 g5 h5 a6 b6 c6 d6 e6 f6 g6 h6 dq15/a-1 v ss byte# a16 a15 a14 a12 a13 dq13 dq6 dq14 dq7 a11 a10 a8 a9 v cc dq4 dq12 dq5 nc nc reset# we# dq11 dq3 dq10 dq2 nc a18 nc ry/by# dq9 dq1 dq8 dq0 a5 a6 a17 a7 oe# v ss ce# a0 a1 a2 a4 a3 fbga top view, balls facing down
november 2, 2006 21504e5 am29f800b 7 data sheet pin configuration a0?a18 = 19 addresses dq0?dq14 = 15 data inputs/outputs dq15/a-1 = dq15 (data input/output, word mode), a-1 (lsb address input, byte mode) byte# = selects 8-bit or 16-bit mode ce# = chip enable oe# = output enable we# = write enable reset# = hardware reset pin, active low ry/by# = ready/busy# output v cc = +5.0 v single power supply (see product selector guide for device speed ratings and voltage supply tolerances) v ss = device ground nc = pin not connected internally logic symbol 19 16 or 8 dq0?dq15 (a-1) a0?a18 ce# oe# we# reset# byte# ry/by#
8 am29f800b 21504e5 november 2, 2006 data sheet ordering information standard products amd standard products are available in several packages and operating ranges. the order number (valid combination) is formed by a combination of the elements below. valid combinations valid combinations list configurations planned to be sup - ported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly released combinations. am29f800b t -70 e c temperature range c = commercial (0c to +70c) d = commercial (0c to +70c) with pb-free package i = industrial (?40 c to +85 c) f = industrial (?40 c to +85 c) with pb-free package e = extended (?55 c to +125 c) k = extended (?55 c to +125 c) with pb-free package package type e = 48-pin thin small outline package (tsop) standard pinout (ts 048) s = 44-pin small outline package (so 044) wb = 48-ball fine pitch ball grid array (fbga) 0.80 mm pitch, 6 x 9 mm package (fbb048) this device is also available in known good die (kgd) form. see publication number 21536 for more information. speed option see product selector guide and valid combinations boot code sector architecture t = top sector b = bottom sector device number/description am29f800b 8 megabit (1 m x 8-bit/512k x 16-bit) cmos flash memory 5.0 volt-only read, program and erase valid combinations am29f800bt-55, am29f800bb-55 ec, ei, ee, ed, ef, ek sc, si, se, sd, sf, sk am29f800bt-70, am29f800bb-70 am29f800bt-90, am29f800bb-90 am29f800bt-120, am29f800bb-120 valid combinations for fbga packages order number package marking am29f800bt-55, am29f800bb-55 wbc, wbi, wbe, wbd, wbf, wbk f800bt55v, f800bb55v c, i, e, d, f, k am29f800bt-70, am29f800bb-70 f800bt70v, f800bb70v am29f800bt-90, am29f800bb-90 f800bt90v, f800bb90v am29f800bt-120, am29f800bb-120 f800bt12v, f800bb12v
november 2, 2006 21504e5 am29f800b 9 data sheet device bus operations this section describes the requirements and use of the device bus operations, which are initiated through the internal command register. the command register it - self does not occupy any addressable memory loca - tion. the register is composed of latches that store the commands, along with the address and data informa - tion needed to execute the command. the contents of the register serve as inputs to the internal state ma - chine. the state machine outputs dictate the function of the device. the appropriate device bus operations table lists the inputs and control levels required, and the resulting output. the following subsections describe each of these operations in further detail. table 1. am29f800b device bus operations legend: l = logic low = v il , h = logic high = v ih , v id = 12.0 0.5 v, x = don?t care, d in = data in, d out = data out, a in = address in note: see the sections on sector group protection and temporary sector unprotect for more information. word/byte configuration the byte# pin controls whether the device data i/o pins dq15?dq0 operate in the byte or word configura - tion. if the byte# pin is set at logic ?1?, the device is in word configuration, dq15?dq0 are active and con - trolled by ce# and oe#. if the byte# pin is set at logic ?0?, the device is in byte configuration, and only data i/o pins dq0?dq7 are ac - tive and controlled by ce# and oe#. the data i/o pins dq8?dq14 are tri-stated, and the dq15 pin is used as an input for the lsb (a-1) address function. requirements for reading array data to read array data from the outputs, the system must drive the ce# and oe# pins to v il . ce# is the power control and selects the device. oe# is the output control and gates array data to the output pins. we# should re - main at v ih . the internal state machine is set for reading array data upon device power-up, or after a hardware reset. this ensures that no spurious alteration of the mem - ory content occurs during the power transition. no command is necessary in this mode to obtain array data. standard microprocessor read cycles that as - sert valid addresses on the device address inputs produce valid data on the device data outputs. the device remains enabled for read access until the command register contents are altered. see ?reading array data? for more information. refer to the ac read operations table for timing specifica - tions and to the read operations timings diagram for the timing waveforms. i cc1 in the dc characteristics table represents the active current specification for reading array data. writing commands/command sequences to write a command or command sequence (which in - cludes programming data to the device and erasing sectors of memory), the system must drive we# and ce# to v il , and oe# to v ih . an erase operation can erase one sector, multiple sec - tors, or the entire device. the sector address tables in - dicate the address space that each sector occupies. a ?sector address? consists of the address bits required to uniquely select a sector. see the ?command defini - operation ce# oe# we# reset# a0?a18 dq0?dq7 dq8?dq15 byte# = v ih byte# = v il read l l h h a in d out d out high-z write l h l h a in d in d in high-z cmos standby v cc 0.5 v x x v cc 0.5 v x high-z high-z high-z ttl standby h x x h x high-z high-z high-z output disable l h h h x high-z high-z high-z hardware reset x x x l x high-z high-z high-z temporary sector unprotect (see note) x x x v id a in d in d in x
10 am29f800b 21504e5 november 2, 2006 data sheet tions? section for details on erasing a sector or the en - tire chip, or suspending/resuming the erase operation. after the system writes the autoselect command se - quence, the device enters the autoselect mode. the system can then read autoselect codes from the inter - nal register (which is separate from the memory array) on dq7?dq0. standard read cycle timings apply in this mode. refer to the ?autoselect mode? and ?autoselect command sequence? sections for more information. i cc2 in the dc characteristics table represents the ac - tive current specification for the write mode. the ?ac characteristics? section contains timing specification tables and timing diagrams for write operations. program and erase operation status during an erase or program operation, the system may check the status of the operation by reading the status bits on dq7?dq0. standard read cycle timings and i cc read specifications apply. refer to ?write operation status? for more information, and to each ac charac - teristics section for timing diagrams. standby mode when the system is not reading or writing to the device, it can place the device in the standby mode. in this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, inde - pendent of the oe# input. the device enters the cmos standby mode when ce# and reset# pins are both held at v cc 0.5 v. (note that this is a more restricted voltage range than v ih .) the device enters the ttl standby mode when ce# and reset# pins are both held at v ih . the device re - quires standard access time (t ce ) for read access when the device is in either of these standby modes, before it is ready to read data. the device also enters the standby mode when the re - set# pin is driven low. refer to the next section, ?re - set#: hardware reset pin? . if the device is deselected during erasure or program - ming, the device draws active current until the operation is completed. in the dc characteristics tables, i cc3 represents the standby current specification. reset#: hardware reset pin the reset# pin provides a hardware meth od of reset - ting the device to reading array data. when the system drives the reset# pin low for at least a period of t rp , the device immediately terminates any operation in progress, tristates all data output pins, and ignores all read/write attempts for the duration of the reset# pulse. the device also resets the internal state ma - chine to reading array data. the operation that was in - terrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. current is reduced for the duration of the reset# pulse. when reset# is held at v il , the device enters the ttl standby mode; if reset# is held at v ss 0.5 v, the device enters the cmos standby mode. the reset# pin may be tied to the system reset cir - cuitry. a system reset would thus also reset the flash memory, enabling the system to read the boot-up firm - ware from the flash memory. if reset# is asserted during a program or erase oper - ation, the ry/by# pin remains a ?0? (busy) until the in - ternal reset operation is complete, which requires a time of t ready (during embedded algorithms). the system can thus monitor ry/by# to determine whether the reset operation is comp lete. if reset# is asserted when a program or erase operation is not executing (ry/by# pin is ?1?), the reset operation is completed within a time of t ready (not during embedded algo - rithms). the system can read data t rh after the re - set# pin returns to v ih . refer to the ac characteristics tables for reset# pa - rameters and timing diagram. output disable mode when the oe# input is at v ih , output from the device is disabled. the output pins are placed in the high imped - ance state.
november 2, 2006 21504e5 am29f800b 11 data sheet table 2. am29f800bt top boot block sector address table note: address range is a18:a-1 in byte mode and a18:a0 in word mode. see the ?word/byte conf iguration? section for more information. sector a18 a17 a16 a15 a14 a13 a12 sector size (kbytes/ kwords) address range (in hexadecimal) (x16) address range (x8) address range sa0 0 0 0 0 x x x 64/32 00000h?07fffh 00000h?0ffffh sa1 0 0 0 1 x x x 64/32 08000h?0ffffh 10000h?1ffffh sa2 0 0 1 0 x x x 64/32 10000h?17fffh 20000h?2ffffh sa3 0 0 1 1 x x x 64/32 18000h?1ffffh 30000h?3ffffh sa4 0 1 0 0 x x x 64/32 20000h?27fffh 40000h?4ffffh sa5 0 1 0 1 x x x 64/32 28000h?2ffffh 50000h?5ffffh sa6 0 1 1 0 x x x 64/32 30000h?37fffh 60000h?6ffffh sa7 0 1 1 1 x x x 64/32 38000h?3ffffh 70000h?7ffffh sa8 1 0 0 0 x x x 64/32 40000h?47fffh 80000h?8ffffh sa9 1 0 0 1 x x x 64/32 48000h?4ffffh 90000h?9ffffh sa10 1 0 1 0 x x x 64/32 50000h?57fffh a0000h?affffh sa11 1 0 1 1 x x x 64/32 58000h?5ffffh b0000h?bffffh sa12 1 1 0 0 x x x 64/32 60000h?67fffh c0000h?cffffh sa13 1 1 0 1 x x x 64/32 68000h?6ffffh d0000h?dffffh sa14 1 1 1 0 x x x 64/32 70000h?77fffh e0000h?effffh sa15 1 1 1 1 0 x x 32/16 78000h?7bfffh f0000h?f7fffh sa16 1 1 1 1 1 0 0 8/4 7c000h?7cfffh f8000h?f9fffh sa17 1 1 1 1 1 0 1 8/4 7d000h?7dfffh fa000h?fbfffh sa18 1 1 1 1 1 1 x 16/8 7e000h?7ffffh fc000h?fffffh
12 am29f800b 21504e5 november 2, 2006 data sheet table 3. am29f800bb bottom boot block sector address table note: address range is a18:a-1 in byte mode and a18:a0 in word mode. see the ?word/byte conf iguration? sectionfor more information. autoselect mode the autoselect mode provides manufacturer and de - vice identification, and sector protection verification, through identifier codes output on dq7?dq0. this mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. however, the autoselect codes can also be accessed in-system through the command register. when using programming equipment, the autoselect mode requires v id (11.5 v to 12.5 v) on address pin a9. address pins a6 , a1, and a0 must be as shown in autoselect codes (high voltage method) table. in addi - tion, when verifying sector protection, the sector ad - dress must appear on the appropriate highest order address bits. refer to the corresponding sector ad - dress tables. the command definitions table shows the remaining address bits that are don?t care. when all necessary bits have been set as required, the program - ming equipment may then read the corresponding identifier code on dq7?dq0. to access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in the command defini - tions table. this method does not require v id . see ?command definitions? for details on using the autose - lect mode. sector a18 a17 a16 a15 a14 a13 a12 sector size (kbytes/ kwords) address range (in hexadecimal) (x16) address range (x8) address range sa0 0 0 0 0 0 0 x 16/8 00000h?01fffh 00000h?03fffh sa1 0 0 0 0 0 1 0 8/4 02000h?02fffh 04000h?05fffh sa2 0 0 0 0 0 1 1 8/4 03000h?03fffh 06000h?07fffh sa3 0 0 0 0 1 x x 32/16 04000h?07fffh 08000h?0ffffh sa4 0 0 0 1 x x x 64/32 08000h?0ffffh 10000h?1ffffh sa5 0 0 1 0 x x x 64/32 10000h?17fffh 20000h?2ffffh sa6 0 0 1 1 x x x 64/32 18000h?1ffffh 30000h?3ffffh sa7 0 1 0 0 x x x 64/32 20000h?27fffh 40000h?4ffffh sa8 0 1 0 1 x x x 64/32 28000h?2ffffh 50000h?5ffffh sa9 0 1 1 0 x x x 64/32 30000h?37fffh 60000h?6ffffh sa10 0 1 1 1 x x x 64/32 38000h?3ffffh 70000h?7ffffh sa11 1 0 0 0 x x x 64/32 40000h?47fffh 80000h?8ffffh sa12 1 0 0 1 x x x 64/32 48000h?4ffffh 90000h?9ffffh sa13 1 0 1 0 x x x 64/32 50000h?57fffh a0000h?affffh sa14 1 0 1 1 x x x 64/32 58000h?5ffffh b0000h?bffffh sa15 1 1 0 0 x x x 64/32 60000h?67fffh c0000h?cffffh sa16 1 1 0 1 x x x 64/32 68000h?6ffffh d0000h?dffffh sa17 1 1 1 0 x x x 64/32 70000h?77fffh e0000h?effffh sa18 1 1 1 1 x x x 64/32 78000h?7ffffh f0000h?fffffh
november 2, 2006 21504e5 am29f800b 13 data sheet table 4. am29f800b autoselect codes (high voltag e method) l = logic low = v il , h = logic high = v ih , sa = sector address, x = don?t care. sector protection/unprotection the hardware sector protection feature disables both program and erase operations in any sector. the hardware sector unprotection feature re-enables both program and erase operations in previously pro - tected sectors. sector protection/unprotection must be implemented using programming equipment. the procedure re - quires a high voltage (v id ) on address pin a9 and the control pins. details on this method are provided in a supplement, publication number 20374. contact an amd representative to obtain a copy of the appropriate document. the device is shipped with all sectors unprotected. amd offers the option of programming and protecting sectors at its factory prio r to shipping the device through amd?s expressflash? service. contact an amd representative for details. it is possible to determine whether a sector is protected or unprotected. see ?autoselect mode? for details. temporary sector unprotect this feature allows temporary unprotection of previ - ously protected sectors to change data in-system. the sector unprotect mode is activated by setting the reset# pin to v id . during this mode, formerly pro - tected sectors can be programmed or erased by se - lecting the sector addresses. once v id is removed from the reset# pin, all the previously protected sectors are protected again. figure 1 shows the algo - rithm, and the temporary sector unprotect diagram shows the timing waveforms, for this feature. figure 1. temporary sector unprotect operation description mode ce# oe# we# a18 to a12 a11 to a10 a9 a8 to a7 a6 a5 to a2 a1 a0 dq8 to dq15 dq7 to dq0 manufacturer id : amd l l h x x v id x l x l l x 01h device id: am29f800b (top boot block) word l l h x x v id x l x l h 22h d6h byte l l h x d6h device id: am29f800b (bottom boot block) word l l h x x v id x l x l h 22h 58h byte l l h x 58h sector protection verification l l h sa x v id x l x h l x 01h (protected) x 00h (unprotected) start perform erase or program operations reset# = v ih temporary sector unprotect completed (note 2) reset# = v id (note 1) notes: 1. all protected sectors unprotected. 2. all previously protected sectors are protected once again.
14 am29f800b 21504e5 november 2, 2006 data sheet hardware data protection the command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to the command defi - nitions table). in addition, the following hardware data protection measures prevent accidental erasure or pro - gramming, which might otherwise be caused by spuri - ous system level signals during v cc power-up and power-down transitions, or from system noise. low v cc write inhibit when v cc is less than v lko , the device does not ac - cept any write cycles. this protects data during v cc power-up and power-down. the command register and all internal program/erase circuits are disabled, and the device resets. subsequent writes are ignored until v cc is greater than v lko . the system must provide the proper signals to the control pins to prevent uninten - tional writes when v cc is greater than v lko . write pulse ?glitch? protection noise pulses of less than 5 ns (typical) on oe#, ce# or we# do not initiate a write cycle. logical inhibit write cycles are inhibited by holding any one of oe# = v il , ce# = v ih or we# = v ih . to initiate a write cycle, ce# and we# must be a logical zero while oe# is a logical one. power-up write inhibit if we# = ce# = v il and oe# = v ih during power up, the device does not accept commands on the rising edge of we#. the internal state machine is automatically reset to reading array data on power-up. command definitions writing specific address and data commands or se - quences into the command register initiates device op - erations. the command definitions table defines the valid register command sequences. writing incorrect address and data values or writing them in the im - proper sequence resets the device to reading array data. all addresses are latched on the falling edge of we# or ce#, whichever happens later. all data is latched on the rising edge of we# or ce#, whichever happens first. refer to the appropriate timing diagrams in the ?ac characteristics? section. reading array data the device is automatically set to reading array data after device power-up. no commands are required to retrieve data. the device is also ready to read array data after completing an embedded program or em - bedded erase algorithm. after the device accepts an erase suspend command, the device enters the erase suspend mode. the sys - tem can read array data using the standard read tim - ings, except that if it reads at an address within erase- suspended sectors, the device outputs status data. after completing a programming operation in the erase suspend mode, the system may once again read array data with the same exception. see ?erase sus - pend/erase resume commands? for more information on this mode. the system must issue the reset command to re-en - able the device for reading array data if dq5 goes high, or while in the autoselect mode. see the ?reset com - mand? section, next. see also ?requirements for reading array data? in the ?device bus operations? section for more information. the read operations table provides the read parame - ters, and read operation timings diagram shows the timing diagram. reset command writing the reset command to the device resets the de - vice to reading array data. address bits are don?t care for this command. the reset command may be written between the se - quence cycles in an erase command sequence before erasing begins. this resets the device to reading array data. once erasure begins, however, the device ig - nores reset commands until the operation is complete. the reset command may be written between the se - quence cycles in a program command sequence be - fore programming begins. this resets the device to reading array data (also applies to programming in erase suspend mode). once programming begins, however, the device ignores reset commands until the operation is complete. the reset command may be written between the se - quence cycles in an autoselect command sequence. once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during erase suspend). if dq5 goes high during a program or erase operation, writing the reset command returns the device to read - ing array data (also applies during erase suspend).
november 2, 2006 21504e5 am29f800b 15 data sheet autoselect command sequence the autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. the command definitions table shows the address and data requirements. this method is an alternative to that shown in the autose lect codes (high voltage method) table, which is intended for prom program - mers and requires v id on address bit a9. the autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. the device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. a read cycle at address xx00h or retrieves the manu - facturer code. a read cycle at address xx01h in word mode (or 02h in byte mode) returns the device code. a read cycle containing a sector address (sa) and the address 02h in word mode (or 04h in byte mode) re - turns 01h if that sector is protected, or 00h if it is un - protected. refer to the sector address tables for valid sector addresses. the system must write the reset command to exit the autoselect mode and return to reading array data. word/byte program command sequence the system may program the device by byte or word, on depending on the state of the byte# pin. program - ming is a four-bus-cycle operation. the program com - mand sequence is initiated by writing two unlock write cycles, followed by the program set-up command. the program address and data are written next, which in turn initiate the embedded program algorithm. the system is not required to provide further controls or tim - ings. the device automatically provides internally gen - erated program pulses and verify the programmed cell margin. the command definitions take shows the ad - dress and data requirements for the byte program com - mand sequence. when the embedded program algorithm is complete, the device then returns to reading array data and ad - dresses are no longer latched. the system can deter - mine the status of the program operation by using dq7, dq6, or ry/by#. see ?write operation status? for in - formation on these status bits. any commands written to the device during the em - bedded program algorithm are ignored. note that a hardware reset immediately terminates the program - ming operation. the program command sequence should be reinitiated once the device has reset to read - ing array data, to ensure data integrity. programming is allowed in any sequence and across sector boundaries. a bit cannot be programmed from a ?0? back to a ?1?. attempting to do so may halt the operation and set dq5 to ?1?, or cause the data# polling algorithm to indicate the operation was suc - cessful. however, a succeeding read will show that the data is still ?0?. only erase operations can convert a ?0? to a ?1?. note: see the appropriate command definitions table for program command sequence. figure 2. program operation chip erase command sequence chip erase is a six-bus-cycle operation. the chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the embedded erase algorithm. the device does not require the system to preprogram prior to erase. the embedded erase algo - rithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not required to provide any con - trols or timings during these operations. the command definitions table shows the address and data require - ments for the chip erase command sequence. start write program command sequence data poll from system verify data? no yes last address? no yes programming completed increment address embedded program algorithm in progress
16 am29f800b 21504e5 november 2, 2006 data sheet any commands written to the chip during the embed - ded erase algorithm are ignored. note that a hardware reset during the chip erase operation immediately ter - minates the operation. the chip erase command se - quence should be reinitiated once the device has returned to reading array data, to ensure data integrity. the system can determine the status of the erase operation by using dq7, dq6, dq2, or ry/by#. see ?write operation status? for information on these status bits. when the embedded erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. figure 3 illustrates the algorithm for the erase opera - tion. see the erase/program operations tables in ?ac characteristics? for parameters, and to the chip/sector erase operation timings for timing waveforms. sector erase co mmand sequence sector erase is a six bus cycle operation. the sector erase command sequence is initiated by writing two un - lock cycles, followed by a set-up command. two addi - tional unlock write cycles are then followed by the address of the sector to be erased, and the sector erase command. the command definitions table shows the address and data requirements for the sec - tor erase command sequence. the device does not require the system to preprogram the memory prior to erase. the embedded erase algo - rithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. the system is not required to provide any controls or tim - ings during these operations. after the command sequence is written, a sector erase time-out of 50 s begins. during the time-out period, additional sector addresses and sector erase com - mands may be written. loading the sector erase buffer may be done in any sequence, and the number of sec - tors may be from one sector to all sectors. the time be - tween these additional cycles must be less than 50 s, otherwise the last address and command might not be accepted, and erasure may begin. it is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. the interrupts can be re-enabled after the last sector erase command is written. if the time between additional sector erase commands can be assumed to be less than 50 s, the system need not monitor dq3. any command other than sector erase or erase suspend during the time-out period resets the device to reading array data. the system must rewrit e the command sequence and any additional sector addresses and commands. the system can monitor dq3 to determine if the sector erase timer has timed out. (see the ?dq3: sector erase timer? section.) the time-out begins from the rising edge of the final we# pulse in the command sequence. once the sector erase operation has begun, only the erase suspend command is valid. all other commands are ignored. note that a hardware reset during the sector erase operation immediately terminates the op - eration. the sector erase command sequence should be reinitiated once the device has returned to reading array data, to ensure data integrity. when the embedded erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. the system can determine the sta - tus of the erase operation by using dq7, dq6, dq2, or ry/by#. refer to ?write operation status? for informa - tion on these status bits. figure 3 illustrates the algorithm for the erase opera - tion. refer to the erase/program operations tables in the ?ac characteristics? section for parameters, and to the sector erase operations timing diagram for timing waveforms. erase suspend/erase resume commands the erase suspend command allows the system to in - terrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. this command is valid only during the sector erase operation, including the 50 s time-out period during the sector erase command sequence. the erase suspend command is ignored if written during the chip erase operation or embedded program algo - rithm. writing the erase suspend command during the sector erase time-out immediately terminates the time-out period and suspends the erase operation. ad - dresses are ?don?t-cares? when writing the erase sus - pend command. when the erase suspend command is written during a sector erase operation, the device requires a maximum of 20 s to suspend the erase operation. however, when the erase suspend command is written during the sector erase time-out, the device immediately ter - minates the time-out period and suspends the erase operation. after the erase operation has been suspended, the system can read array data from or program data to any sector not selected for erasure. (the device ?erase suspends? all sectors selected for erasure.) normal read and write timings and command definitions apply. reading at any address within erase-suspended sec - tors produces status da ta on dq7?dq0. the system can use dq7, or dq6 and dq2 together, to determine if a sector is actively erasing or is erase-suspended. see ?write operation status? for information on these status bits. after an erase-suspended program operation is com - plete, the system can once again read array data within non-suspended sectors. the system can determine the status of the program operation using the dq7 or
november 2, 2006 21504e5 am29f800b 17 data sheet dq6 status bits, just as in the standard program oper - ation. see ?write operation status? for more informa - tion. the system may also write the autoselect command sequence when the device is in the erase suspend mode. the device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. when the device exits the autoselect mode, the device reverts to the erase suspend mode, and is ready for another valid operation. see ?autoselect command sequence? for more information. the system must write the erase resume command (address bits are ?don?t care?) to exit the erase suspend mode and continue the sector erase operation. further writes of the resume command are ignored. another erase suspend command can be written after the de - vice has resumed erasing. notes: 1. see the appropriate command definitions table for erase command sequence. 2. see ?dq3: sector erase timer? for more information. figure 3. erase operation start write erase command sequence data poll from system data = ffh? no yes erasure completed embedded erase algorithm in progress
18 am29f800b 21504e5 november 2, 2006 data sheet command definitions table 5. am29f800b command definitions legend: x = don?t care ra = address of the memory location to be read. rd = data read from location ra during read operation. pa = address of the memory location to be programmed. addresses latch on the falling edge of the we# or ce# pulse, whichever happens later. pd = data to be programmed at location pa. data latches on the rising edge of we# or ce# pulse, whichever happens first. sa = address of the sector to be verified (in autoselect mode) or erased. address bits a18?a12 uniquely select any sector. notes: 1. see ta bl e 1 for description of bus operations. 2. all values are in hexadecimal. 3. except when reading array or autoselect data, all bus cycles are write operations. 4. data bits dq15?dq8 are don?t cares for unlock and command cycles. 5. address bits a18?a11 are don?t cares for unlock and command cycles, unless sa or pa required. 6. no unlock or command cycles required when reading array data. 7. the reset command is required to return to reading array data when device is in the autoselect mode, or if dq5 goes high (while the device is providing status data). 8. the fourth cycle of the autoselect command sequence is a read cycle. 9. the data is 00h for an unprotected sector and 01h for a protected sector. see ?autoselect command sequence? see ?autoselect command sequence? for more information. 10. the system may read and program in non-erasing sectors, or enter the autoselect mode, when in the erase suspend mode. the erase suspend command is valid only during a sector erase operation. 11. the erase resume command is valid only during the erase suspend mode. command sequence (note 1) cycle bus cycles (notes 2?5) first second third fourth fifth sixth addr data addr data addr data addr data addr data addr data read (note 6) 1 ra rd reset (note 7) 1 xxx f0 autoselect (note 8) manufacturer id word 4 555 aa 2aa 55 555 90 x00 01 byte aaa 555 aaa device id, top boot block word 4 555 aa 2aa 55 555 90 x01 22d6 byte aaa 555 aaa x02 d6 device id, bottom boot block word 4 555 aa 2aa 55 555 90 x01 2258 byte aaa 555 aaa x02 58 sector protect verify (note 9) word 4 555 aa 2aa 55 555 90 (sa) x02 xx00 xx01 byte aaa 555 aaa (sa) x04 00 01 program word 4 555 aa 2aa 55 555 a0 pa pd byte aaa 555 aaa chip erase word 6 555 aa 2aa 55 555 80 555 aa 2aa 55 555 10 byte aaa 555 aaa aaa 555 aaa sector erase word 6 555 aa 2aa 55 555 80 555 aa 2aa 55 sa 30 byte aaa 555 aaa aaa 555 erase suspend (note 10) 1 xxx b0 erase resume (note 11) 1 xxx 30
november 2, 2006 21504e5 am29f800b 19 data sheet write operation status the device provides several bits to determine the sta - tus of a write operation: dq2, dq3, dq5, dq6, dq7, and ry/by#. ta b l e 6 and the following subsections de - scribe the functions of these bits. dq7, ry/by#, and dq6 each offer a method for determining whether a program or erase operation is complete or in progress. these three bits are discussed first. dq7: data# polling the data# polling bit, dq7, indicates to the host system whether an embedded algorithm is in progress or completed, or whether the device is in erase suspend. data# polling is valid after the rising edge of the final we# pulse in the program or erase command sequence. during the embedded program algorithm, the device outputs on dq7 the complement of the datum pro - grammed to dq7. this dq7 status also applies to pro - gramming during erase suspend. when the embedded program algorithm is complete, the device outputs the datum programmed to dq7. the system must provide the program address to read valid status information on dq7. if a program address falls within a protected sector, data# polling on dq7 is active for ap - proximately 2 s, then the device returns to reading array data. during the embedded erase algorithm, data# polling produces a ?0? on dq7. when the embedded erase al - gorithm is complete, or if the device enters the erase suspend mode, data# polling produces a ?1? on dq7. this is analogous to the complement/true datum output described for the embedded program algorithm: the erase function changes all the bits in a sector to ?1?; prior to this, the device outputs the ?complement,? or ?0.? the system must provide an address within any of the sectors selected for erasure to read valid status in - formation on dq7. after an erase command sequence is written, if all sec - tors selected for erasing are protected, data# polling on dq7 is active for approximately 100 s, then the de - vice returns to reading arra y data. if not all selected sectors are protected, the embedded erase algorithm erases the unprotected sectors, and ignores the se - lected sectors that are protected. when the system detects dq7 has changed from the complement to true data, it can read valid data at dq7? dq0 on the following read cycles. this is because dq7 may change asynchronously with dq0?dq6 while output enable (oe#) is asserted low. the data# poll - ing timings (during embedded algorithms) figure in the ?ac characteristics? section illustrates this. table 6 shows the outputs for data# polling on dq7. figure 4 shows the data# polling algorithm. dq7 = data? yes no no dq5 = 1? no yes yes fail pass read dq7?dq0 addr = va read dq7?dq0 addr = va dq7 = data? start notes: 1. va = valid address for programming. during a sector erase operation, a valid address is an address within any sector selected for erasure. during chip erase, a valid address is any non-protected sector address. 2. dq7 should be rechecked even if dq5 = ?1? because dq7 may change simultaneously with dq5. figure 4. data# polling algorithm
20 am29f800b 21504e5 november 2, 2006 data sheet ry/by#: ready/busy# the ry/by# is a dedicated, open-drain output pin that indicates whether an embedded algorithm is in progress or complete. the ry/by# status is valid after the rising edge of the final we# pulse in the command sequence. since ry/by# is an open-drain output, sev - eral ry/by# pins can be tied together in parallel with a pull-up resistor to v cc . if the output is low (busy), the device is actively erasing or programming. (this includes programming in the erase suspend mode.) if the output is high (ready), the device is ready to read array data (including during the erase suspend mode), or is in the standby mode. table 6 shows the outputs for ry/by#. the timing dia - grams for read, reset, program, and erase shows the relationship of ry/by# to other signals. dq6: toggle bit i toggle bit i on dq6 indicates whether an embedded program or erase algorithm is in progress or complete, or whether the device has entered the erase suspend mode. toggle bit i may be read at any address, and is valid after the rising edge of the final we# pulse in the command sequence (prior to the program or erase op - eration), and during the sector erase time-out. during an embedded program or erase algorithm op - eration, successive read cycles to any address cause dq6 to toggle. (the system may use either oe# or ce# to control the read cycles .) when the operation is complete, dq6 stops toggling. after an erase command sequence is written, if all sectors selected for erasing are protected, dq6 tog - gles for approximately 100 s, then returns to reading array data. if not all selected sectors are protected, the embedded erase algorithm erases the unpro - tected sectors, and ignores the selected sectors that are protected. the system can use dq6 and dq2 together to deter - mine whether a sector is acti vely erasing or is erase- suspended. when the device is actively erasing (that is, the embedded erase algorithm is in progress), dq6 toggles. when the device enters the erase suspend mode, dq6 stops toggling. however, the system must also use dq2 to determine which sectors are erasing or erase-suspended. alternatively, the system can use dq7 (see the subsection on ?dq7: data# polling? ). if a program address falls within a protected sector, dq6 toggles for approximately 2 s after the program command sequence is written, then returns to reading array data. dq6 also toggles during the erase-suspend-program mode, and stops toggling once the embedded pro - gram algorithm is complete. the write operation status table shows the outputs for toggle bit i on dq6. refer to figure 5 for the toggle bit algorithm, and to the toggle bit timings figure in the ?ac characteristics? section for the timing diagram. the dq2 vs. dq6 figure shows the differences be - tween dq2 and dq6 in graphical form. see also the subsection on ?dq2: toggle bit ii? . dq2: toggle bit ii the ?toggle bit ii? on dq2, when used with dq6, indi - cates whether a particular sector is actively erasing (that is, the embedded erase algorithm is in progress), or whether that sector is erase-suspended. toggle bit ii is valid after the rising edge of the final we# pulse in the command sequence. dq2 toggles when the system reads at addresses within those sectors that have been selected for era - sure. (the system may use either oe# or ce# to con - trol the read cycles.) but dq2 cannot distinguish whether the sector is actively erasing or is erase-sus - pended. dq6, by comparison, indicates whether the device is actively erasing, or is in erase suspend, but cannot distinguish which sectors are selected for era - sure. thus, both status bits are required for sector and mode information. refer to ta b l e 6 to compare outputs for dq2 and dq6. figure 5 shows the toggle bit algorithm in flowchart form, and the section ?dq2: toggle bit ii? explains the algorithm. see also the ?dq6: toggle bit i? subsection. refer to the toggle bit timings figure for the toggle bit timing diagram. the dq2 vs. dq6 figure shows the dif - ferences between dq2 and dq6 in graphical form. reading toggle bits dq6/dq2 refer to figure 5 for the following discussion. when - ever the system initially begins reading toggle bit sta - tus, it must read dq7?dq0 at least twice in a row to determine whether a toggle bit is toggling. typically, a system would note and store the value of the toggle bit after the first read. after the second read, the system would compare the new value of the toggle bit with the first. if the toggle bit is not toggling, the device has completed the program or erase operation. the sys - tem can read array data on dq7?dq0 on the following read cycle. however, if after the initia l two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of dq5 is high (see the section on dq5). if it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped tog - gling just as dq5 went high. if the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. if it is still toggling, the device did not complete the operation successfully, and
november 2, 2006 21504e5 am29f800b 21 data sheet the system must write the re set command to return to reading array data. the remaining scenario is that the system initially de - termines that the toggle bit is toggling and dq5 has not gone high. the system may continue to monitor the toggle bit and dq5 through successive read cycles, de - termining the status as described in the previous para - graph. alternatively, it may choose to perform other system tasks. in this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of figure 5 ). dq5: exceeded timing limits dq5 indicates whether the program or erase time has exceeded a specified intern al pulse count limit. under these conditions dq5 produces a ?1.? this is a failure condition that indicates the program or erase cycle was not successfully completed. the dq5 failure condition may appear if the system tries to program a ?1? to a location that is previously pro - grammed to ?0.? only an erase operation can change a ?0? back to a ?1.? under this condition, the device halts the operation, and when the operation has ex - ceeded the timing limits, dq5 produces a ?1.? under both these conditions, the system must issue the reset command to return the device to reading array data. dq3: sector erase timer after writing a sector erase command sequence, the system may read dq3 to determine whether or not an erase operation has begun. (the sector erase timer does not apply to the chip erase command.) if addi - tional sectors are selected for erasure, the entire time- out also applies after each additional sector erase command. when the time-out is complete, dq3 switches from ?0? to ?1.? the system may ignore dq3 if the system can guarantee that the time between ad - ditional sector erase commands will always be less than 50 s. see also the ?sector erase command se - quence? section. after the sector erase command sequence is written, the system should read the status on dq7 (data# poll - ing) or dq6 (toggle bit i) to ensure the device has ac - cepted the command sequence, and then read dq3. if dq3 is ?1?, the internally controlled erase cycle has be - gun; all further commands (other than erase suspend) are ignored until the erase operation is complete. if dq3 is ?0?, the device will accept additional sector erase commands. to ensure the command has been accepted, the system software should check the status of dq3 prior to and following each subsequent sector erase command. if dq3 is high on the second status check, the last command might not have been ac - cepted. ta b l e 6 shows the outputs for dq3. start no yes yes dq5 = 1? no yes toggle bit = toggle? no program/erase operation not complete, write reset command program/erase operation complete read dq7?dq0 toggle bit = toggle? read dq7?dq0 twice read dq7?dq0 notes: 1. read toggle bit twice to determine whether or not it is toggling. see text. 2. recheck toggle bit because it may stop toggling as dq5 changes to ?1?. see text. figure 5. toggle bit algorithm (notes 1, 2) (note 1)
22 am29f800b 21504e5 november 2, 2006 data sheet table 6. write operation status notes: 1. dq7 and dq2 require a valid address when reading status informat ion. refer to the appropriate subsection for further details. 2. dq5 switches to ?1? when an embedded program or embedde d erase operation has exceeded the maximum timing limits. see ?dq5: exceeded timing limits? for more information. operation dq7 (note 1) dq6 dq5 (note 2) dq3 dq2 (note 1) ry/by# standard mode embedded program algorithm dq7# toggle 0 n/a no toggle 0 embedded erase algorithm 0 toggle 0 1 toggle 0 erase suspend mode reading within erase suspended sector 1 no toggle 0 n/a toggle 1 reading within non-erase suspended sector data data data data data 1 erase-suspend-program dq7# toggle 0 n/a n/a 0
november 2, 2006 21504e5 am29f800b 23 data sheet absolute maximum ratings storage temperature plastic packages . . . . . . . . . . . . . . . ?65 c to +150 c ambient temperature with power applied. . . . . . . . . . . . . . ?55 c to +125 c voltage with respect to ground v cc (note 1) . . . . . . . . . . . . . . . . ?2.0 v to +7.0 v a9 , oe# , and reset# (note 2). . . . . . . . . . . .?2.0 v to +12.5 v all other pins (note 1) . . . . . . . . . ?0.5 v to +7.0 v output short circuit current (note 3) . . . . . . 200 ma notes: 1. minimum dc voltage on input or i/o pins is ?0.5 v. during voltage transitions, input or i/o pins may undershoot v ss to ?2.0 v for periods of up to 20 ns. see figure 6 . maximum dc voltage on input or i/o pins is v cc +0.5 v. during voltage transitions, input or i/o pins may overshoot to v cc +2.0 v for periods up to 20 ns. see figure 7 . 2. minimum dc input voltage on pins a9, oe#, and reset# is ?0.5 v. during voltage transitions, a9, oe#, and reset# may undershoot v ss to ?2.0 v for periods of up to 20 ns. see figure 6 . maximum dc input voltage on pin a9 is +12.5 v which may overshoot to +13.5 v for periods up to 20 ns. 3. no more than one output may be shorted to ground at a time. duration of the short ci rcuit should not be greater than one second. note: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. operating ranges commercial (c) devices ambient temperature (t a ) . . . . . . . . . . . 0c to +70c industrial (i) devices ambient temperature (t a ) . . . . . . . . . ?40c to +85c extended (e) devices ambient temperature (t a ) . . . . . . . . ?55c to +125c v cc supply voltages v cc for all devices . . . . . . . . . . . . . . .+4.5 v to +5.5 v note: operating ranges define th ose limits between which the functionality of the device is guaranteed. 20 ns 20 ns +0.8 v ?0.5 v 20 ns ?2.0 v figure 6. maximum negative overshoot waveform 20 ns 20 ns v cc +2.0 v v cc +0.5 v 20 ns 2.0 v figure 7. maximum positive overshoot waveform
24 am29f800b 21504e5 november 2, 2006 data sheet dc characteristics ttl/nmos compatible notes: 1. the i cc current listed is typically le ss than 2 ma/mhz, with oe# at v ih . 2. maximum i cc specifcations are tested with v cc = v cc max 3. i cc active while embedded erase or embedded program is in progress. 4. not 100% tested. 5. i cc3 = 20 a max at extended temperature (>+85c) parameter description test conditions min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1.0 a i lit a9, oe#, reset input load current v cc = v cc max ; a9 = oe# = reset# = 12.5 v 35 a i lo output leakage current v out = v ss to v cc 1.0 a i cc1 v cc active read current (notes 1 , 2 ) ce# = v il , oe# = v ih , f = 5 mhz, byte mode 19 40 ma ce# = v il , oe# = v ih , f = 5 mhz, word mode 19 50 ma i cc2 v cc active write current (notes 2, 3 and 4 ) ce# = v il, oe# = v ih 36 60 ma i cc3 v cc standby current (notes 2, 5) ce#, oe#, and reset# = v ih, 0.4 1 ma v il input low voltage ?0.5 0.8 v v ih input high voltage 2.0 v cc + 0.5 v v id voltage for autoselect and temporary sector unprotect v cc = 5.0 v 11.5 12.5 v v ol output low voltage i ol = 5.8 ma, v cc = v cc min 0.45 v v oh output high voltage i oh = ?2.5 ma, v cc = v cc min 2.4 v v lko low v cc lock-out voltage (note 4) 3.2 4.2 v
november 2, 2006 21504e5 am29f800b 25 data sheet dc characteristics cmos compatible notes: 1. i cc active while embedded erase or embedded program is in progress. 2. maximum i cc specifcations are tested with v cc = v cc max 3. not 100% tested. parameter description test conditions min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1.0 a i lit a9, oe#, reset input load current v cc = v cc max , a9 = oe# = reset = 12.5 v 35 a i lo output leakage current v out = v ss to v cc , v cc = v cc max 1.0 a i cc1 v cc active read current (note 2) ce# = v il , oe# = v ih , f = 5 mhz byte mode 20 40 ma ce# = v il , oe# = v ih , f = 5 mhz word mode 28 50 ma i cc2 v cc active write current (notes 1 , 2 , 3 ) ce# = v il , oe# = v ih 30 50 ma i cc3 v cc standby current (note 2) ce# and reset# = v cc 0.5 v, oe# = v ih 0.3 5 a v il input low voltage ?0.5 0.8 v v ih input high voltage 0.7 x v cc v cc + 0.3 v v id voltage for autoselect and temporary sector unprotect v cc = 5.0 v 11.5 12.5 v v ol output low voltage i ol = 5.8 ma, v cc = v cc min 0.45 v v oh1 output high voltage i oh = ?2.5 ma, v cc = v cc min 0.85 v cc v v oh2 i oh = ?100 a, v cc = v cc min v cc ?0.4 v v lko low v cc lock-out voltage (note 3) 3.2 4.2 v
26 am29f800b 21504e5 november 2, 2006 data sheet test conditions table 7. test specifications key to switching waveforms 2.7 k c l 6.2 k 5.0 v device under te s t figure 8. test setup note: diodes are in3064 or equivalents. test condition -55 all others unit output load 1 ttl gate output load capacitance, c l (including jig capacitance) 30 100 pf input rise and fall times 5 20 ns input pulse levels 0.0?3.0 0.45?2.4 v input timing measurement reference levels 1.5 0.8, 2.0 v output timing measurement reference levels 1.5 0.8, 2.0 v waveform inputs outputs steady changing from h to l changing from l to h don?t care, any change permitted changing, state unknown does not apply center line is high impedance state (high z)
november 2, 2006 21504e5 am29f800b 27 data sheet ac characteristics read operations notes: 1. not 100% tested. 2. see figure 8 and ta b l e 7 for test specifications. parameter description speed options jedec std test setup -55 -70 -90 -120 unit t avav t rc read cycle time (note 1) min 55 70 90 120 ns t avqv t acc address to output delay ce# = v il oe# = v il max 55 70 90 120 ns t elqv t ce chip enable to output delay oe# = v il max 55 70 90 120 ns t glqv t oe output enable to output delay max 30 30 35 50 ns t ehqz t df chip enable to output high z (note 1) max 20 20 20 30 ns t ghqz t df output enable to output high z (note 1) max 20 20 20 30 ns t oeh output enable hold time (note 1) read min 0 ns toggle and data# polling min 10 ns t axqx t oh output hold time from addresses, ce# or oe#, whichever occurs first (note 1) min 0 ns t ce outputs we# addresses ce# oe# high z output valid high z addresses stable t rc t acc t oeh t oe 0 v ry/by# reset# t df t oh figure 9. read operations timings
28 am29f800b 21504e5 november 2, 2006 data sheet ac characteristics hardware reset (reset#) note: not 100% tested. parameter description all speed options jedec std test setup unit t ready reset# pin low (during embedded algorithms) to read or write (see note) max 20 s t ready reset# pin low (not during embedded algorithms) to read or write (see note) max 500 ns t rp reset# pulse width min 500 ns t rh reset# high time before read (see note) min 50 ns t rb ry/by# recovery time min 0 ns reset# ry/by# ry/by# t rp t ready reset timings not during embedded algorithms t ready ce#, oe# t rh ce#, oe# reset timings during embedded algorithms reset# t rp t rb figure 10. reset# timings
november 2, 2006 21504e5 am29f800b 29 data sheet ac characteristics word/byte configuration (byte#) parameter speed options jedec std description -55 -70 -90 -120 unit t elfl/ t elfh ce# to byte# switching low or high max 5 ns t flqz byte# switching low to output high z max 20 20 20 30 ns t fhqv byte# switching high to output active min 55 70 90 120 ns dq15 output data output (dq0?dq7) ce# oe# byte# t elfl dq0?dq14 data output (dq0?dq14) dq15/a-1 address input t flqz byte# switching from word to byte mode dq15 output data output (dq0?dq7) byte# t elfh dq0?dq14 data output (dq0?dq14) dq15/a-1 address input t fhqv byte# switching from byte to word mode figure 11. byte# timings for read operations note: refer to the erase/program operations table for t as and t ah specifications. figure 12. byte# timings for write operations ce# we# byte# the falling edge of the last we# signal t hold (t ah ) t set (t as )
30 am29f800b 21504e5 november 2, 2006 data sheet ac characteristics erase/program operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter description speed options jedec std -55 -70 -90 -120 unit t avav t wc write cycle time (note 1) min 55 70 90 120 ns t avwl t as address setup time min 0 ns t wlax t ah address hold time min 45 45 45 50 ns t dvwh t ds data setup time min 25 30 45 50 ns t whdx t dh data hold time min 0 ns t oes output enable setup time min 0 ns t ghwl t ghwl read recovery time before write (oe# high to we# low) min 0 ns t elwl t cs ce# setup time min 0 ns t wheh t ch ce# hold time min 0 ns t wlwh t wp write pulse width min 30 35 45 50 ns t whwl t wph write pulse width high min 20 ns t whwh1 t whwh1 programming operation (note 2) byte ty p 7 s word ty p 12 t whwh2 t whwh2 sector erase operation (note 2) ty p 1 sec t vcs v cc setup time (note 1) min 50 s t rb recovery time from ry/by# min 0 ns t busy program/erase valid to ry/by# delay max 30 30 35 50 ns
november 2, 2006 21504e5 am29f800b 31 data sheet ac characteristics figure 13. program operation timings oe# we# ce# v cc data addresses t ds t ah t dh t wp pd t whwh1 t wc t as t wph t vcs 555h pa pa read status data (last two cycles) a0h t cs status d out program command sequence (last two cycles) ry/by# t rb t busy t ch pa notes: 1. pa = program address, pd = program data, d out is the true data at the program address. 2. illustration shows device in word mode.
32 am29f800b 21504e5 november 2, 2006 data sheet ac characteristics oe# ce# addresses v cc we# data 2aah sa t ah t wp t wc t as t wph 555h for chip erase 10 for chip erase 30h t ds t vcs t cs t dh 55h t ch in progress complete t whwh2 va va ry/by# t rb t busy note: sa = sector address. va = valid address for reading status data. figure 14. chip/sector erase operation timings
november 2, 2006 21504e5 am29f800b 33 data sheet ac characteristics we# ce# oe# high z t oe high z dq7 dq0?dq6 ry/by# t busy complement true addresses va t oeh t ce t ch t oh t df va va status data complement status data true valid data valid data t acc t rc note: va = valid address. illustration shows first status cycle after command sequence, last status read cycle, and array data read c ycle. figure 15. data# polling timings (during embedded algorithms) we# ce# oe# high z t oe dq6/dq2 ry/by# t busy addresses va t oeh t ce t ch t oh t df va va t acc t rc valid data valid status valid status (first read) (second read) (stops toggling) valid status va note: va = valid address; not required for dq6. illustration shows firs t two status cycle after command sequence, last status read cy cle, and array data read cycle. figure 16. toggle bit timings (during embedded algorithms)
34 am29f800b 21504e5 november 2, 2006 data sheet ac characteristics temporary sector unprotect note: not 100% tested. parameter all speed options jedec std description unit t vidr v id rise and fall time (see note) min 500 ns t rsp reset# setup time for temporary sector unprotect min 4 s note: the system may use oe# or ce# to toggle dq2 and dq6. dq2 toggles only when read at an address within the erase-suspended sector. figure 17. dq2 vs. dq6 enter erase erase erase enter erase suspend program erase suspend read erase suspend read erase we# dq6 dq2 erase complete erase suspend suspend program resume embedded erasing reset# t vidr 12 v 0 or 5 v ce# we# ry/by# t vidr t rsp program or erase command sequence 0 or 5 v figure 18. temporary sector unprotect timing diagram
november 2, 2006 21504e5 am29f800b 35 data sheet ac characteristics alternate ce# cont rolled erase/pr ogram operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter speed options jedec std description -55 -70 -90 -120 unit t avav t wc write cycle time (note 1) min 55 70 90 120 ns t avel t as address setup time min 0 ns t elax t ah address hold time min 45 45 45 50 ns t dveh t ds data setup time min 25 30 45 50 ns t ehdx t dh data hold time min 0 ns t oes output enable setup time min 0 ns t ghel t ghel read recovery time before write (oe# high to we# low) min 0 ns t wlel t ws we# setup time min 0 ns t ehwh t wh we# hold time min 0 ns t eleh t cp ce# pulse width min 30 35 45 50 ns t ehel t cph ce# pulse width high min 20 ns t whwh1 t whwh1 programming operation (note 2) byte ty p 7 s word ty p 12 t whwh2 t whwh2 sector erase operation (note 2) ty p 1 sec
36 am29f800b 21504e5 november 2, 2006 data sheet ac characteristics t ghel t ws oe# ce# we# reset# t ds data t ah addresses t dh t cp dq7# d out t wc t as t cph pa data# polling a0 for program 55 for erase t rh t whwh1 or 2 ry/by# t wh pd for program 30 for sector erase 10 for chip erase 555 for program 2aa for erase pa for program sa for sector erase 555 for chip erase t busy notes: 1. pa = program address, pd = program data, sa = sect or address, dq7# = complement of data input, d out = array data. 2. figure indicates the last two bus cycles of the command sequence, with the device in word mode. figure 19. alternate ce# controlled write operation timings
november 2, 2006 21504e5 am29f800b 37 data sheet erase and programming performance notes: 1. typical program and erase times assume the following conditions: 25 c, 5.0 v v cc , 1,000,000 cycles. additionally, programming typicals assume checkerboard pattern. 2. under worst case conditions of 90c, v cc = 4.5 v, 1,000,000 cycles. 3. the typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maxi mum program times listed. 4. in the pre-programming step of the embedded erase algorithm, all bytes are programmed to 00h before erasure. 5. system-level overhead is the time required to execute the four-bus-cycle sequence for the program command. see ta b l e 5 for further information on command definitions. 6. the device has a guaranteed minimum erase and program cycle endurance of 1,000,000 cycles. latchup characteristics includes all pins except v cc . test conditions: v cc = 5.0 v, one pin at a time. tsop and so pi n capacitance notes: 1. sampled, not 100% tested. 2. test conditions t a = 25c, f = 1.0 mhz. data retention parameter typ (note 1) max (note 3) unit comments sector erase time 1.0 8 s excludes 00h programming prior to erasure (note 4) chip erase time (note 2) 19 s byte programming time 7 300 s excludes system level overhead (note 5) word programming time 12 500 s chip programming time (note 2) byte mode 7.2 21.6 s word mode 6.3 18.6 s description min max input voltage with respect to v ss on all pins except i/o pins (including a9, oe#, and reset#) ?1.0 v 12.5 v input voltage with respect to v ss on all i/o pins ?1.0 v v cc + 1.0 v v cc current ?100 ma +100 ma parameter symbol parameter description test setup typ max unit c in input capacitance v in = 0 6 7.5 pf c out output capacitance v out = 0 8.5 12 pf c in2 control pin capacitance v in = 0 7.5 9 pf parameter test conditions min unit minimum pattern data retention time 150 c 10 ye a r s 125 c 20 ye a r s
38 am29f800b 21504e5 november 2, 2006 data sheet physical dimensions so 044?44-pin smal l outline package dwg rev ac; 10/99
november 2, 2006 21504e5 am29f800b 39 data sheet physical dimensions (continued) ts 048?48-pin standard pin out thin small outline package (tsop) dwg rev aa; 10/99
40 am29f800b 21504e5 november 2, 2006 data sheet physical dimensions (continued) fbb048?48-ball fine-pitch ball grid array (fbga) 6 x 9 mm package dwg rev af; 10/99
november 2, 2006 21504e5 am29f800b 41 data sheet revision summary revision a (august 1997) initial release. revision b (october 1997) global added -55 speed option. changed data sheet designa - tion from advance information to preliminary. sector protection/unprotection corrected text to indicate that these functions can only be implemented using programming equipment. table 1, device bus operations revised to indicate inputs for both ce# and reset# are required for standby mode. program command sequence changed to indicate data# polling is active for 2 s after a program command sequence if the sector spec - ified is protected. sector erase command sequence and dq3: sector erase timer corrected sector erase timeout to 50 s. erase suspend command changed to indicate that the device suspends the erase operation a maximum of 20 s after the rising edge of we#. dc characteristics changed to indicate v id min and max values are 11.5 to 12.5 v, with a v cc test condition of 5.0 v. added typical values to ttl table. revised cmos typical standby current (i cc3 ). figure 14: chip/sector erase operation timings; figure 19: alternate ce# controlled write operation timings corrected hexadecimal values in address and data waveforms. in figure 19, corrected data values for chip and sector erase. erase and programming performance corrected word and chip programming times. revision c (january 1998) global formatted for consistency with other 5.0 volt-only data sheets. revision c+1 (april 1998) distinctive characteristics changed typical program/erase current to 30 ma to match the cmos dc characteristics table. changed minimum endurance to 1 million write cycles per sector guaranteed. ac characteristics erase/program operations: corrected the notes refer - ence for t whwh1 and t whwh2 . these parameters are 100% tested. changed t ds and t cp specifications for 55 ns device. changed t whwh1 word mode specification to 12 s. alternate ce# controlled erase/program operations: corrected the notes reference for t whwh1 and t whwh2 . these parameters are 100% tested. changed t ds and t cp specifications for 55 ns device. changed t whwh1 word mode specification to 12 s. temporary sector unprotect table added note reference for t vidr . this parameter is not 100% tested. erase and programming performance in notes 1 and 6, changed the endurance specification to 1 million cycles. revision c+2 (april 1998) product selector guide deleted the -55 speed option for v cc = 5.0 v 5%. added the -55 speed option for v cc = 5.0 v 10%. ordering information valid combinations for am29f800bt-55 and am29f800bb-55: added the extended temperature range for all package types. operating ranges v cc supply voltages: deleted ?v cc for 5% devices . . . . +4.75 v to +5.25 v?. changed ?v cc for 10% devices . . . . +4.5 v to +5.5 v? to ?v cc for all devices . . . . +4.5 v to +5.5 v?. erase and programming performance note 2: deleted ?(4.75 v for -55)?.
42 am29f800b 21504e5 november 2, 2006 data sheet revision summary (continued) revision d (january 1999) distinctive characteristics added the 20-year data retention subbullet. ordering information optional processing : deleted ?b = burn-in?. dc characteristics?ttl/nmos compatible i lit : added oe# and reset to the description column. changed ?a9 = 12.5 v? to ?a9 = oe# = reset = 12.5 v? in the test conditions column. i lo , i cc1 , i cc2 : deleted ?v cc = v cc max? in te s t conditions. i cc3 : added note 4, ?i cc3 = 20 a max at extended temperatures (>+85c)?. dc characteristics? cmos compatible i lit : added oe# and reset to the description column. changed ?a9 = 12.5 v? to ?a9 = oe# = reset = 12.5 v? in the test conditions column. i cc1 , i cc2 , i cc3 : deleted ?v cc = v cc max?; added note 2 ?maximum i cc specifications are tested with v cc = v cc max?. revision d+1 (march 23, 1999) command definitions table corrected sa definition in legend; range should be a18?a12. in note 4, a17 should be a18. revision d+2 (july 2, 1999) global added references to availability of device in known good die (kgd) form. revision e (november 16, 1999) ac characteristics?figure 13. program operations timing and figure 14 . chip/sector erase operations deleted t ghwl and changed oe# waveform to start at high. physical dimensions replaced figures with more detailed illustrations. revision e+1 (a ugust 4, 2000) global added fbga package. revision e+2 (j une 4, 2004) ordering information added pb-free opns. revision e3 (december 22, 2005) global deleted reverse tsop package option and 150 ns speed option. revision e4 (may 19, 2006) added ?not recommended for new designs? note. ac characteristics changed t busy specification to maximium value. revision e5 (november 2, 2006) deleted ?not recommended for new designs? note. colophon the products described in this document are designed, developed and manufactured as contemplated for general use, including wit hout limita - tion, ordinary industrial use, general o ffice use, personal use, and household use, but are not designed, developed and manufac tured as con - templated (1) for any use that includes fatal risks or dangers th at, unless extremely high safety is secured, could have a seri ous effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic contro l, mass transport control, medical life support system, missile launch control in we apon system), or (2) for any use where chance of failure is intolera ble (i.e., submersible repeater and artifici al satellite). please note that spansion inc. will not be liable to you and/or any third party for any claims or damages arisi ng in connection with above-mentioned uses of the products. any se miconductor devices have an inherent chance of failure. you must protect agains t injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and pr evention of over-current levels and other abnormal operating conditions. if any products described in this document represent goods or technologies subject to certain restrictions on expor t under the foreign exchange and foreign trade law of japan, the us export administra tion regulations or the applicable laws of any other country, the prior au - thorization by the respective government entit y will be required for export of those products. trademarks copyright ? 2006 spansion inc. all rights reserved. spansion, t he spansion logo, mirrorbit, orna nd, hd-sim, and combinations th ereof are trademarks of spansion inc. other names are for informational purposes only and may be trademarks of their respective owners. copyright ? 2004?2006 advanced micro devices, inc. all rights reserv ed. amd, the amd logo, and combinations thereof are registe red trade - marks of advanced micro devices, inc. expressflash is a trademar k of advanced micro devices, inc. product names used in this pu blication are for identification purposes only and may be tr ademarks of their respective companies.

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